A Breakthrough in Self-Assembled Chips
A Breakthrough in Self-Assembled Chips
North Carolina State University researchers have revolutionized chip manufacturing with a fast, cost-effective method using a directed metal ligand reaction for self-assembling electronic devices.
Advancing technology enabled the design and construction of smaller, more complex computer chips, empowering them to tackle complex tasks. Traditional fabrication methods demanded significant time and resources, slowing production and delaying delivery. Researchers at North Carolina State University’s (NCSU) Department of Materials Science and Engineering have revolutionized chip manufacturing by creating a fast, cost-effective method for self-assembling electronic devices using a directed metal ligand reaction (D-Met).
Inspired by self-assembly in nature, the research team applied chemistry techniques to build diodes and transistors from the bottom-up. They started with undercooled liquid metal particles—tiny droplets of metal alloys that remained liquid below their usual melting point. Trapped near a channel, these particles interacted with an acidic solution containing ligands, molecules or ions that bond to metal atoms, which etched (removed) metal ions from their surfaces. The etched ions reacted with the solution, forming organometallic materials that precipitate and self-assembled into long, thin, wire-like structures.
Julia Chang, a postdoctoral research scholar at NCSU, explained, “Before we placed liquid metal particles in a solution forming bulk organometallic materials in situ. Now we directed this reaction into patterns on a substrate, creating the core of most of the electronics and optics components.”
Postdoctoral Research Scholar Julia Chang. Photo: NCSU
As the solution evaporated at the channel’s end, capillary action drove the liquid forward, creating a convective current that guided wire assembly. A restricted channel ensured laminar flow. Using minimal energy, the method produced uniform wire sizes without the need for pumps. Finally, rather than burning off the resulting solution, researchers calcined the arrays, heating them in low oxygen to a high temperature below their melting points, to form graphitic carbon, transforming the organometallic material into semiconductor-grade metal oxide wires and enhancing the material’s electrical and optical properties.
Martin Thuo, a professor at NCSU, elaborated, “We avoided pumps to move the liquid inside the channel. Instead, we relied on a natural process. Evaporation at the end of the channel created convective currents, acting as our vehicle—similar to how a tree uses capillary forces to pull water to its top.”
Multiple factors influenced the process and allowed for product variations. Changing the mold altered shapes and patterns, while adjusting the arrays tailored them for specific applications. Thuo noted, “Because we form the material one metal atom at a time, we can create sharp curvatures, including 90° turns, which are otherwise difficult to achieve.” Modifying the elements incorporated different materials, and shifts in temperature, humidity, or the speed of the convective current created unique results.
This research showed promise not only in traditional chip development but also in advancing edge and quantum computing. Edge computing pushed processing power and data storage closer to the data source, reducing reliance on centralized storage. This approach reduced latency, improved bandwidth, enhanced reliability in areas with limited network connectivity, and strengthened data security. However, it also required devices to include sufficient on-board processing and storage, leading to larger and more complex chips in terms of physical size or capacity.
More for You: Computer Chips Could Reduce AI's Energy Footprint
Quantum computing chips, though significantly different from traditional ones, relied on conventional chips to act as interfaces between quantum processors and standard microelectronics. These chips can bridge the gap as computing transition to quantum technologies.
The self-assembled organometallic arrays demonstrated promising optical properties alongside their electrical attributes. Their high refractive index also makes them suitable for optical applications such as lasers or transmitting light signals in fiber optics.
“For technologies like artificial intelligence and the Internet of Things, immense computational power is crucial,” Chang explained. “3D chips architectures and innovative materials offer tremendous potential for increasing computational capabilities. Additionally, we can adapt grid fabrication techniques into existing semiconductor manufacturing processes, modernizing current technologies.”
Lithography played a crucial role in traditional computer chip manufacturing, miniaturizing transistors and components to produce faster, more powerful, and energy-efficient chips. However, the process consumed significant time, typically three to four months per chip, required high-powered equipment, large cooling requirements, and produced a relatively low number of usable chips.
Traditional methods followed a top-down approach, starting with a larger silicon wafer and removing material to shape desired features, much like sculpting a block of stone. Engineers applied a light-sensitive material (photoresist) to a silicone wafer, exposed it to light through a patterned mask, and developed the photoresist to form circuit patterns. Repeating this process multiple times built the complex, multi-layered structures of modern integrated circuits.
NCSU’s self-assembling technology introduced a breakthrough in chip design and manufacturing. Researchers harnessed natural processes and bottom-up assembly to create precise, energy-efficient nanowires with applications in edge computing, quantum computing, and optics.
Moreover, this approach cut energy use, reduced waste, and enabled intricate designs that challenged traditional top-down methods. As computational power demands increased, this method provided a scalable, adaptable solution that integrated smoothly with existing semiconductor processes. By revolutionizing chip production, enhancing optical properties, and modernizing manufacturing techniques, this research laid a foundation for future advancements in computing and electronics.
Nicole Imeson is an engineer and writer in Calgary, Alberta.
Inspired by self-assembly in nature, the research team applied chemistry techniques to build diodes and transistors from the bottom-up. They started with undercooled liquid metal particles—tiny droplets of metal alloys that remained liquid below their usual melting point. Trapped near a channel, these particles interacted with an acidic solution containing ligands, molecules or ions that bond to metal atoms, which etched (removed) metal ions from their surfaces. The etched ions reacted with the solution, forming organometallic materials that precipitate and self-assembled into long, thin, wire-like structures.
Revolutionary process
Julia Chang, a postdoctoral research scholar at NCSU, explained, “Before we placed liquid metal particles in a solution forming bulk organometallic materials in situ. Now we directed this reaction into patterns on a substrate, creating the core of most of the electronics and optics components.”
Postdoctoral Research Scholar Julia Chang. Photo: NCSU
Martin Thuo, a professor at NCSU, elaborated, “We avoided pumps to move the liquid inside the channel. Instead, we relied on a natural process. Evaporation at the end of the channel created convective currents, acting as our vehicle—similar to how a tree uses capillary forces to pull water to its top.”
Multiple factors influenced the process and allowed for product variations. Changing the mold altered shapes and patterns, while adjusting the arrays tailored them for specific applications. Thuo noted, “Because we form the material one metal atom at a time, we can create sharp curvatures, including 90° turns, which are otherwise difficult to achieve.” Modifying the elements incorporated different materials, and shifts in temperature, humidity, or the speed of the convective current created unique results.
Edge and quantum computing
This research showed promise not only in traditional chip development but also in advancing edge and quantum computing. Edge computing pushed processing power and data storage closer to the data source, reducing reliance on centralized storage. This approach reduced latency, improved bandwidth, enhanced reliability in areas with limited network connectivity, and strengthened data security. However, it also required devices to include sufficient on-board processing and storage, leading to larger and more complex chips in terms of physical size or capacity. More for You: Computer Chips Could Reduce AI's Energy Footprint
Quantum computing chips, though significantly different from traditional ones, relied on conventional chips to act as interfaces between quantum processors and standard microelectronics. These chips can bridge the gap as computing transition to quantum technologies.
The self-assembled organometallic arrays demonstrated promising optical properties alongside their electrical attributes. Their high refractive index also makes them suitable for optical applications such as lasers or transmitting light signals in fiber optics.
“For technologies like artificial intelligence and the Internet of Things, immense computational power is crucial,” Chang explained. “3D chips architectures and innovative materials offer tremendous potential for increasing computational capabilities. Additionally, we can adapt grid fabrication techniques into existing semiconductor manufacturing processes, modernizing current technologies.”
Chip technology advancements
Lithography played a crucial role in traditional computer chip manufacturing, miniaturizing transistors and components to produce faster, more powerful, and energy-efficient chips. However, the process consumed significant time, typically three to four months per chip, required high-powered equipment, large cooling requirements, and produced a relatively low number of usable chips.
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NCSU’s self-assembling technology introduced a breakthrough in chip design and manufacturing. Researchers harnessed natural processes and bottom-up assembly to create precise, energy-efficient nanowires with applications in edge computing, quantum computing, and optics.
Moreover, this approach cut energy use, reduced waste, and enabled intricate designs that challenged traditional top-down methods. As computational power demands increased, this method provided a scalable, adaptable solution that integrated smoothly with existing semiconductor processes. By revolutionizing chip production, enhancing optical properties, and modernizing manufacturing techniques, this research laid a foundation for future advancements in computing and electronics.
Nicole Imeson is an engineer and writer in Calgary, Alberta.
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