Microelectromechanical Engineering Division

MicroElectroMechanical Systems (MEMS) are defined as a miniature device or an array of devices combining electrical, mechanical, optical, chemical and/or biological components fabricated via integrated circuit or other similar manufacturing techniques. It is by it’s very nature a multi-disciplinary field

Research, insight, and then applications of MEMS will shape the basis for the creation of technologies that will impact areas as diverse as computing, information technology, biomedical technology, the environment, along with energy, transportation, robotics,. manufacturing, deep space studies, and national security.

Since its start in the late 1960s, the MEMS field has been growing rapidly, especially since 1989. Currently, patents in MEMS are being issued at a rate of over one per day!

The MEMS Division will work towards the goals of: providing a focal point for the Mechanical Engineers entering and practicing in the MEMS field; Facilitating interaction and discussion among the MEMS community and generate opportunities for collaboration in order to spawn and maintain creativity in the field; Identifying the needs and problems of the MEMS community and bring together appropriate people to address them; Provide a platform to generate standards and guidelines for MEMS processes and technologies; Educate and inform engineers and scientists in various fields of the ongoing developments in the MEMS field; Help train new, multi-disciplinary MEMS researchers to enhance the growth of the field.

Greg Hader, US Army DEVCOM AC
Chair
July 2024 – June 2025

Uttam Chakravarty, University of New Orleans
Vice Chair
July 2024 – June 2025

Namwon Kim, Texas State University
Past Chair
July 2024 – June 2025

In-Hyouk Song, Texas State University
Treasurer
July 2024 – June 2025

Jeong Tae Ok, Shawnee State University
Secretary
July 2024 – June 2025

Shaurya Prakash, Ohio State University
Member-at-Large
July 2024 – June 2025

Laura Herrera, ASME
Sr. TEC Operations Manager | May 2021 – OPEN

Links to helpful online resources related to the division are below. If you have suggestions for other resources, please contact the division chair or ASME staff.

ASME Landmarks Program

Landmarks, sites and collections of historic importance to mechanical engineering are designated by ASME through its History and Heritage Landmarks Program.

ASME Division

• Electronic & Photonic Packaging Division of ASME

Universities

• Berkeley
• UCLA
• MIT

National Labs

• Lawrence Livermore
• Sandia

MEMS Information Sites

• MEMS Clearinghouse
• Trimmer.net

Track 13 at IMECE
November 17 - 21, 2024
Oregon Convention Center
Portland, Oregon USA

Share your research. Advance your career. Submit your abstract to track 13 by March 19, 2024. 
Track 13: Micro - and Nano-Systems Engineering Packaging
Topics
13-1 General Topics of MEMS/NEMS
13-2 Design and Fabrication, Analysis, Processes, and Technology for Micro and Nano Devices and Systems
13-3 Computational Studies on MEMS and Nanostructures
13-4 Applications of Micro and Nano Systems in Medicine and Biology
13-5 Micro and Nano Devices
13-6 Applied Mechanics and Materials in Micro- and Nano-Systems
13-7 Packaging Technology in Heterogeneous Integration Applications
13-8 Energy Harvesting and Storage
13-9 Advanced Manufacturing of Microsystems, Microstructures, and Miniaturized Actuators
13-10 Microfluidics 2023
13-11 Inertial Navigation: MEMS/NEMS to Bio-Inspired
13-12 MEMS based Electrochemical Sensors in Biomedical Applications
13-13 Simulations of Material Modeling and Behavior Analysis for MEMS Applications

Student Competitions 
$350 towards the conference registration fee.
Best Papers: 3 Awards
Innovative Paper: 3 Awards
Global Impact Paper: 3 Awards

Track 13 Organizers
TIn-Hyouk Song, Texas State University;
Jeong Tae Ok, Shawnee State University
Shaurya Prakash, Ohio State University