Electronic & Photonic Packaging Division

The Electronic and Photonic Packaging Division (EPPD) of ASME has as its objectives international cooperation, understanding, and promotion of efforts and disciplines in Microelectronics, Photonics, Microwave and Microelectromechanical Systems Packaging Engineering. The Division is concerned with all design and engineering aspects related to theoretical (analytical and computer-aided) and experimental problems and results associated with the application of methods and approaches of engineering and applied mechanics to the analysis, design, manufacturing, testing and operation of microelectronics, optoelectronics and photonics components, devices, equipment and systems.

Baris Dagruoz
Chair | July 2023 - June 2024

Sreekant Narumanchi
Vice Chair | July 2023 – June 2024

Jin Yang
Treasurer | July 2022 – June 2024

Ankur Jain
Secretary | July 2022 - June 2024

Przemslaw Gromala
Member at Large | July 2023 - June 2024

Seungbae Park
Past Chair | July 2023 – June 2024

Barbara Zlatnik
Staff Contact

Featured Event

InterPACK®  International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Holiday Inn San Jose - Silicon Valley
San Jose, CA
October 8–10, 2024

Past Events

InterPACK® International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
San Diego Mission Valley, San Diego, CA, October 24–26, 2023

Interpack 2022 - International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Anaheim, CA, October 25 - 27, 2022

InterPACK 2021
Virtual, Online
October 26 - 28 2021

InterPACK® 2020
Virtual, Online
October 27 - 29, 2020

InterPACK® 2019
Hilton Anaheim, Anaheim, CA,
October 7 - 9, 2019

Recognition of outstanding achievement in engineering is one of the major objectives of ASME. Through its programs of honors and awards, ASME recognizes outstanding contributions to the art and science of engineering.

Society Awards:

• Allan Kraus Thermal Management Medal
• Avram Bar-Cohen Memorial Medal

Division Awards:

• Thermal Management Award (Refer to Allan Kraus Thermal Management Medal)
  Note: EPPD Division Level Thermal Award Winners are not eligible for the Allan Kraus Thermal Management Medal
  For outstanding contributions to thermal management of electronic and/or photonic components and systems, including design, optimization, experimental techniques, modeling and simulation.
• Mechanics Award
  For outstanding contributions to the applications of engineering mechanics in the field of electronic and/or photonic packaging, including stress analysis, reliability study, experimental methods and computational modeling.
• Women In Engineering Award
  To recognize a women engineer with significant technical achievements in the area of electronic and photonic packaging demonstrated through papers, patents, or product development.
• Young Engineer Award
  To recognize a young engineer with significant technical achievements in the career in the area of electronic and photonic packaging demonstrated through papers, patents, or product development.
• Student Member of the Year Award
  To recognize a current student who has excelled in research and has shown promise to be a strong contributor in the field of electronic and photonic packaging.
• K-16 Clock Award
  (Sponsored by the K-16 Heat Transfer in Electronic Equipment Committee and the Electronic & Photonic Packaging Division)
  To recognize outstanding and continuing contributions to the science and engineering of heat transfer in electronics

Nominations link for processing division awards

Unit Award Nominations

Links to helpful online resources related to the division are below. If you have suggestions for other resources, please contact the division chair or ASME staff.

• Heterogeneous Integration Roadmap
• InterPACK

Other Links of Interest

• ASME Landmarks Program
  Landmarks, sites and collections of historic importance to mechanical engineering are designated by ASME through its History and Heritage Landmarks Program.
• SEMI: Semiconductor Equipment and Materials International
• IMAPS - International Microelectronics And Packaging Society
• IEEE Components, Packaging, & Manufacturing Technology Society
• Society for Experimental Mechanics, Inc.
• NSF Engineering
• Optoelectronics, Microelectronics, Information Technology - Data Storage Systems Center, Carnegie Mellon University  
• Integrated Media Systems Center, University of Southern California
• Laser Focus World Online
• Photonics Online
• Optics.org: Photonics Resources for Scientists & Engineers  
• Printed Wiring Board (PWB) Resource Center
• SMT NET (Surface Mount Technology Network)  
• The Cork Electronics Industry Association (Ireland)
• Armed Forces Communications & Electronics Association
• Electronics Manufacturers Association
• The Semiconductor Subway